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一種陶瓷件用于處理半導體襯底的真空處理室，具有才機加工或才燒結的外表面的非氧化物陶瓷材料；和在該外表面上并形成陶瓷件的外表面的氧化層，該氧化層內包含附著在外表面上的非氧化物陶瓷材料顆粒。
在半導體襯底處理期間，使陶瓷件經等離子體調控處理可使顆粒污染降至低。陶瓷件可由各種材料制成，如氧化鋁、二氧化硅、石英、碳、硅、碳化硅、氮化硅、氮化硼、碳化硼、氮化鋁或碳化鈦。
陶瓷件可為真空處理室的各種部件，如處理室側壁內的襯套、向處理室供給處理氣體的氣體散布板、噴淋頭組件的緩沖板、晶片通道插入件、襯底周圍的聚焦環、電極周圍的邊環、等離子體屏蔽板和/或窗口。（圖/文www.0061234.com）
中譯英：
A ceramic pieces for processing a semiconductor substrate vacuum processing chamber, high machining or sintering of the outer surface of the ceramic material; and on the outer surface and the formation of ceramic parts and the external surface of the oxide layer, the oxide layer contains attached at the external surface of the non oxide ceramic material particle.

During processing of semiconductor substrates, ceramic parts by plasma treatment to control particle contamination can be minimized. The ceramic part can be made from a variety of materials, such as alumina, silica, quartz, carbon, silicon, silicon carbide, silicon nitride, boron nitride, boron carbide, aluminum nitride or titanium carbide.